SEOUL, December 20 (AJP) - Samsung Electronics' $6.4 billion preliminary subsidy agreement with the U.S. government remains the last major chip deal to be finalized, as the Commerce Department announced a $458 million grant for SK Hynix's $3.87 billion AI memory chip facility in Indiana.
Samsung, which plans to invest $45 billion in Texas by 2030, has already completed 98.7 percent of its first fab construction in Taylor, though production start has been delayed to 2026 from the initial target of late 2023.
The company's investment plan has expanded significantly from the original $17 billion announced in November 2021.
"By investing in companies like SK hynix and communities like West Lafayette, the bipartisan CHIPS and Science Act continues to supercharge America's global technology leadership," U.S. Secretary of Commerce Gina Raimondo said, announcing the latest grant to SK Hynix.
The Biden administration has accelerated finalizing chip subsidies before President-elect Donald Trump's transition, having confirmed $7.87 billion for Intel, $6.6 billion for TSMC, and $6.17 billion for Micron.
Industry sources expect Samsung's deal to be concluded by year-end, following the recent pattern of subsidy announcements.
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