Lee Jae-yong reviews next-generation chip technologies at Samsung R&D and manufacturing hubs

By Candice Kim Posted : December 22, 2025, 21:15 Updated : December 22, 2025, 21:15
Samsung Electronics Chairman Lee Jae-yong inspects the cleanroom facilities at the NRD-K advanced semiconductor R&D center in Giheung on Dec. 22 / Courtesy of Samsung Electronics

SEOUL, December 22 (AJP) - Samsung Electronics Chairman Lee Jae-yong visited the company's Giheung and Hwaseong semiconductor campuses on Monday to review research progress and manufacturing readiness for upcoming memory and system semiconductor technologies.

Lee toured the NRD-K complex in Giheung, Samsung's advanced R&D hub dedicated to next-generation memory, foundry and system semiconductor development. The facility focuses on overcoming scaling limits in cutting-edge process nodes and strengthening design capabilities for future chip architectures, according to the company.

He later visited the Hwaseong campus to examine the rollout of manufacturing automation systems incorporating digital-twin and robotics technologies, as well as ongoing applications of AI in production processes.

During the visit, Lee held discussions with senior semiconductor executives, including Jun Young-hyun, head of the DS division, and CTO Song Jae-hyuk, on global market trends and the company's mid- to long-term strategy.

Lee also met engineers involved in commercializing Samsung's latest products—including HBM, D1c-class DRAM and V10-generation NAND—to hear feedback on development, manufacturing and quality challenges.

"We must restore our fundamental technological competitiveness through bold innovation and investment," Lee said during the visit.

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