SK chair meets US big tech leaders for HMB4 pitch

By Candice Kim Posted : February 13, 2026, 16:42 Updated : February 13, 2026, 16:42
SK Group Chairman Chey Tae-won and Nvidia CEO Jensen Huang. (Courtesy of SK hynix)
SEOUL, February 13 (AJP) -SK Group Chairman Chey Tae-won commanding the world's most-sought memory chip unit held a string of meetings with big-tech leaders in the United States to strengthen leadership in AI chip supply chain amid tension with Samsung Electronics over HBM4 supply.

His business meetings included all the big tech names Nvidia, Broadcom, Microsoft, Meta and Google engaged in AI chip accelerators, as he pushed to expand partnerships centered on high-bandwidth memory (HBM) and next-generation AI infrastructure.    

Chey first met Jensen Huang, chief executive of Nvidia, in Santa Clara on Feb. 5 (local time). The two exchanged views on global AI industry trends, demand for advanced semiconductors and cooperation on next-generation GPUs and HBM. Ahead of the meeting, Chey reviewed SK hynix’s supply strategy and shifts in the AI ecosystem, the company said.

On the following day,  Chey visited Broadcom’s headquarters in San Jose for talks with CEO Hock Tan. Their discussions focused on the medium- to long-term outlook for the memory market, supply strategies and investment cooperation. The two sides also explored ways to reflect SK hynix’s HBM technology in Broadcom products from the design stage, as Broadcom develops customized AI accelerators and networking solutions.

On Feb. 10, Chey met Satya Nadella in Seattle to discuss expanding cooperation beyond semiconductors to include AI data centers and cloud-based solutions, reflecting SK Group’s broader push into AI infrastructure and services.
SK Group chair Chey Tae-won with Meta CEO Mark Zuckerberg in San Jose, Feb. 10, 2026 (Courtesy of SK hynix)
The same day, Chey held talks with Meta CEO Mark Zuckerberg in San Jose on long-term memory supply and next-generation AI infrastructure. SK hynix shared its HBM strategy optimized for Meta’s in-house AI accelerator project, MTIA, and discussed early alignment of technology road maps for products beyond HBM4 and HBM4E. 

On the final day of his trip, Feb. 11, Chey met Sundar Pichai at Google’s campus in San Jose. The two agreed that securing memory supply has become a key bottleneck in expanding AI data centers and that stabilizing medium- to long-term supply is critical, as production capacity cannot be expanded quickly. They also discussed cooperation on custom HBM and future HBM4-based chips aligned with Google’s AI roadmap. 
SK Group Chairman Chey Tae-won (left) meeting with Google CEO Sundar Pichai (right). (Courtesy of SK hynix)

SK hynix said the meetings underscore its efforts to deepen partnerships with global tech companies based on its AI memory leadership. The company aims to expand HBM supply while building cooperation that spans next-generation chips, data centers and cloud infrastructure.

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