Lotte Energy Materials and Doosan Electronics’ Electronic BG division have signed a memorandum of understanding to cooperate on evaluating, developing and supplying copper foil needed to produce high-performance printed circuit boards for artificial intelligence data centers and network equipment.
According to industry sources on the 22nd, the two companies agreed to work together on next-generation materials aimed at reducing signal loss and improving reliability, as demand grows for faster, higher-layer PCBs to handle large volumes of data in advanced industries such as AI semiconductors and 5G communications.
The companies signed the MOU in February under the title “MOU on development evaluation and supply cooperation for copper foil used in high-performance PCBs.” They said they would cooperate on developing and applying ultra-very-low-profile (HVLP) copper foil for high-speed transmission environments such as AI accelerators, servers and switches. They also agreed to optimize low-loss copper-clad laminate (CCL) and copper foil, and to build a stable supply system based on quality and delivery schedules for mass-production use.
Through the partnership, Doosan Electronics and Lotte Energy Materials said they aim to strengthen global competitiveness by quickly providing material solutions that meet customer requirements for performance, reliability, manufacturability and supply stability. They also said the collaboration between domestic materials makers would help reduce import dependence for certain items and support supply-chain stability and localization of materials technology.
Kim Yeon-seop, CEO of Lotte Energy Materials, said HVLP copper foil and low-loss CCL are key materials in the AI networking era. “Through cooperation with Doosan Electronics, which leads the global network market, we will advance a stable supply system and further strengthen global competitiveness,” he said.
* This article has been translated by AI.
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