DB HiTek said Tuesday it will take part in PCIM 2026, Europe’s largest power semiconductor exhibition, to be held June 9-11 in Nuremberg, Germany, where it plans to present its latest technology.
In its second consecutive year at the show, the company will share the latest development status of silicon carbide (SiC) and gallium nitride (GaN) processes, which it described as next-generation power semiconductors.
DB HiTek also plans to discuss cooperation with customers in Europe, focusing on its BCDMOS process, which it said has secured industry-leading capabilities.
The company said it is accelerating work to secure next-generation processes. In December, it produced products for more than 20 customers through a multi-project wafer (MPW) run based on SiC and GaN processes. It said deliveries to customers have recently been completed and evaluations are under way.
Based on those results, DB HiTek said it plans to finalize the process technology and begin full-scale mass production starting in 2027.
DB HiTek said it is currently in mass production with about 400 customers in its core power semiconductor business. It also said it plans to keep increasing the share of industrial and automotive products, supported by specialized image sensor process technologies such as single-photon avalanche diode (SPAD) devices.
* This article has been translated by AI.
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