Applied Materials is teaming up with TSMC to accelerate the development of next-generation artificial intelligence (AI) semiconductor technologies. The two companies plan to conduct joint research and development at the EPIC Center, currently being established in Silicon Valley, with a strategy to innovate advanced processes and expedite the transition to mass production.
On May 12, Applied Materials announced the expansion of its strategic partnership with TSMC to hasten the commercialization of semiconductor technologies for the AI era. Building on over 30 years of collaboration, the companies aim to jointly develop materials engineering, equipment, and process integration technologies.
This collaboration will center around the EPIC (Equipment and Process Innovation and Commercialization) Center in Silicon Valley, where key technologies will be developed to create high-performance, low-power semiconductors required for data centers and edge environments. The focus will be on accelerating the speed of technology transfer from research to mass production.
In response to the growing demand for AI and high-performance computing (HPC), the companies plan to develop technologies that improve the power, performance, and area of advanced logic processes, as well as introduce new materials and next-generation equipment to implement 3D transistors and interconnect structures. They will also collaborate to enhance process integration technologies to improve yield and reliability.
As semiconductor miniaturization approaches its limits, this partnership is seen as a model for collaborative innovation across the industry, highlighting that maintaining competitiveness cannot rely solely on the technological advancements of individual companies.
Gary Dickerson, President and CEO of Applied Materials, stated, "The two companies have collaborated at the forefront of semiconductor technology for a long time. Through the EPIC Center, we will accelerate technology development and address manufacturing complexities." Meanwhile, Miwije TSMC Senior Vice President remarked, "Next-generation semiconductor technology hinges on materials engineering and process integration capabilities, and our collaboration at the EPIC Center will expedite technology commercialization."
The EPIC Center is a large semiconductor equipment research and development facility being established with an investment of approximately $5 billion, providing a collaborative environment that spans the entire process from initial research to mass production. This is expected to shorten the time for semiconductor companies to validate technologies and transition to mass production.
* This article has been translated by AI.
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