Hanmico Semiconductor is poised for significant growth in the second quarter of this year, driven by the ongoing demand for global artificial intelligence (AI) semiconductors. The company anticipates a substantial increase in annual revenue as it prepares to establish its U.S. subsidiary, Hanmi USA, by the end of the year.
Hanmico Chairman Kwak Dong-shin stated on May 15, "With the mass production of High Bandwidth Memory (HBM4) ramping up, we are seeing a surge in orders for TC bonders in the second quarter. This trend is expected to accelerate in the second half of the year." He emphasized that Hanmico's TC bonders, which hold the top global market share, will benefit significantly from the expansion of the AI semiconductor market.
The establishment of Hanmi USA in San Jose, California, will enable Hanmico to actively respond to local market demands. The company plans to use the San Jose office as a central hub for rapid technical support, aligning with the operational timelines of new semiconductor factories being established by global firms in the U.S. This strategy includes deploying skilled engineers locally to provide proactive technical assistance.
The formation of Hanmi USA also marks a significant realization of Hanmico's founding vision of serving as a bridge between Korea and the United States, 50 years after its inception. The company was founded by the late Kwak No-kwon, who built his expertise during 14 years at Motorola in the U.S. before establishing Hanmico in Korea, a country that was then a barren landscape for the semiconductor equipment industry. Now, Hanmico plans to make a substantial entry into the U.S. market through Hanmi USA.
As the production of HBM4 expands, Hanmico's growth trajectory is expected to steepen. Analysts are noting that competition among global memory companies to increase HBM production will intensify in the second half of the year, potentially leading to increased orders for TC bonders. Hanmico is currently supplying equipment to global memory companies, including SK Hynix, and anticipates diversifying its revenue portfolio with new products such as next-generation hybrid bonders and 2.5D packaging equipment.
Recent investments in large-scale semiconductor manufacturing facilities in the U.S. have been notable. In the fourth quarter of last year, Intel began operations at a new advanced process-based foundry and packaging plant in Chandler, Arizona. By 2027, Micron aims to have a cutting-edge DRAM and HBM manufacturing hub operational in Boise, Idaho, and is constructing the largest memory production facility in the U.S., known as a "megafab," in Syracuse, New York, set to begin operations in 2028. Additionally, SK Hynix plans to start advanced HBM supply in Lafayette, Indiana, by 2027.
In this context, Hanmico's direct participation in the U.S. government-led AI semiconductor supply chain is expected to yield significant benefits in the future.
Moreover, the establishment of Hanmi USA is significant for building direct collaboration with global hyperscaler companies, which are end-users. Recently, companies like Microsoft, Google, Amazon (AWS), and Meta have been developing their own AI semiconductors, increasingly reviewing and specifying the high-performance memory and essential equipment used in manufacturing processes. Consequently, demand for packaging equipment aimed at hyperscalers is anticipated to rise.
Currently, Hanmico holds the top global market share in TC bonders, which are essential for HBM manufacturing, and plans to launch a prototype of its second-generation hybrid bonder equipment within the year to solidify its leadership in the next-generation HBM market.
In addition to HBM TC bonders, Hanmico aims to drive revenue growth with a variety of equipment. The company is set to supply its 2.5D packaging equipment, including the "2.5D TC Bonder 40" and "2.5D TC Bonder 120," to foundry and OSAT companies this year. The "BOC COB Bonder," which was launched earlier this year as the world's first, has begun supplying global memory companies and is expected to contribute to revenue growth alongside the expanding demand for AI and data centers.
Chairman Kwak stated, "Through our U.S. subsidiary, we plan to actively support our clients' needs closely. We anticipate significant equipment orders alongside the operation of new factories in the U.S., which is emerging as a global semiconductor production hub, and expect continuous revenue growth in the future."
* This article has been translated by AI.
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