Hanmi Semiconductor made its debut at Computex 2026 in Taipei, Taiwan, aiming to strengthen its position in the global supply chain for artificial intelligence (AI) semiconductors with its key equipment, the TC Bonder for HBM (High Bandwidth Memory).
According to industry sources, Hanmi Semiconductor participated in Computex 2026, held from June 2 to June 5 at the Nangang Exhibition Center and the Taipei World Trade Center. Originally a PC and electronics exhibition, Computex has evolved into a platform where major global semiconductor companies, including NVIDIA, AMD, and Intel, showcase advancements in AI technology.
At the exhibition, Hanmi Semiconductor introduced the 'TC Bonder 4' for HBM4 production and the 'Wide TC Bonder' aimed at next-generation HBM production. The TC Bonder is essential for precisely stacking multiple layers of DRAM to create HBM.
The Wide TC Bonder is designed to accommodate the larger die sizes of next-generation HBM production. Increasing die area allows for more through-silicon vias (TSVs) and input/output interfaces, which is advantageous for expanding memory capacity and bandwidth.
The company also unveiled 2.5D packaging equipment for AI semiconductors. Hanmi Semiconductor highlighted its advanced packaging capabilities with the introduction of the '2.5D TC Bonder 40' and '2.5D TC Bonder 120,' which integrate GPUs, CPUs, and HBM on a silicon interposer.
Industry experts note that as HBM generations advance, not only memory performance but also stacking precision and packaging yield become critical factors influencing the overall supply capacity for AI semiconductors.
Hanmi Semiconductor is also working to expand its global customer base. The company is preparing to establish a local subsidiary, Hanmi USA, in San Jose, California, by the end of this year. This strategy aims to enhance local responsiveness in a region where major AI semiconductor companies, including NVIDIA, are concentrated.
Computex 2026 features participation from 1,500 companies and operates 6,000 booths. Key figures in the global AI semiconductor industry, including NVIDIA CEO Jensen Huang and AMD CEO Lisa Su, also delivered keynote speeches.
A Hanmi Semiconductor representative stated, "Computex serves as a venue to confirm the technological trends in the global hardware supply chain, from AI chip design to packaging, physical AI, and finished products. We aim to strengthen our global market leadership with our proprietary TC Bonder and next-generation equipment."
* This article has been translated by AI.
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