[Photo: SK hynix]
SK hynix is set to enhance its production capacity for the sixth generation of high-bandwidth memory (HBM), known as HBM4, by acquiring key equipment from Hanmi Semiconductor. This move is seen as a proactive investment to meet the rising demand for NVIDIA's next-generation AI accelerators.
On June 8, Hanmi Semiconductor announced that it received an order from SK hynix for the 'TC Bonder 4.5 Griffin' equipment, specifically designed for HBM4 manufacturing. The contract is valued at 44.2 billion won (approximately $33 million), with the agreement running from the announcement date until September 2.
Considering that the price for each TC Bonder is around 3 billion won, it is estimated that the order will involve approximately 15 units. This equipment is crucial for the HBM stacking process and will directly impact the increase in HBM production.
The 'TC Bonder 4.5 Griffin' is an upgraded version of existing products, optimized for SK hynix's production lines. It is expected to be installed at the company's Cheongju facility.
The significant influx of TC Bonders essential for HBM4 production is anticipated to accelerate SK hynix's strategy for expanding HBM4 mass production. HBM4 is a key memory product that will be integrated into NVIDIA's next-generation AI platform, Vera Rubin.
This equipment order is viewed as a signal for increased supply of HBM4 to NVIDIA. Jensen Huang, CEO of NVIDIA, stated on June 5 at Gimpo Airport that "certifications for HBM4 from Samsung Electronics, SK hynix, and Micron have been completed, and mass production is currently underway."
On June 8, Hanmi Semiconductor announced that it received an order from SK hynix for the 'TC Bonder 4.5 Griffin' equipment, specifically designed for HBM4 manufacturing. The contract is valued at 44.2 billion won (approximately $33 million), with the agreement running from the announcement date until September 2.
Considering that the price for each TC Bonder is around 3 billion won, it is estimated that the order will involve approximately 15 units. This equipment is crucial for the HBM stacking process and will directly impact the increase in HBM production.
The 'TC Bonder 4.5 Griffin' is an upgraded version of existing products, optimized for SK hynix's production lines. It is expected to be installed at the company's Cheongju facility.
The significant influx of TC Bonders essential for HBM4 production is anticipated to accelerate SK hynix's strategy for expanding HBM4 mass production. HBM4 is a key memory product that will be integrated into NVIDIA's next-generation AI platform, Vera Rubin.
This equipment order is viewed as a signal for increased supply of HBM4 to NVIDIA. Jensen Huang, CEO of NVIDIA, stated on June 5 at Gimpo Airport that "certifications for HBM4 from Samsung Electronics, SK hynix, and Micron have been completed, and mass production is currently underway."
* This article has been translated by AI.
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