SK Hynix has officially begun supplying samples of its next-generation AI-focused high-performance DRAM, 'HBM4E.' This announcement comes just a month after Samsung Electronics shipped its own samples, marking the start of a fierce competition between the two companies in the HBM4E market for AI memory dominance.
On June 18, SK Hynix revealed that it has supplied 12-layer samples of its 7th-generation High Bandwidth Memory (HBM4) to key clients. This new product is a successor to the currently mass-produced 6th-generation HBM (HBM4) and is designed to maximize data processing performance essential for AI training and inference. Initially expected to launch in the second half of this year, the supply timeline was accelerated due to smooth progress in its development schedule.
The new model has evolved in both performance and energy efficiency compared to its predecessor. It achieves a maximum data processing speed of 16 Gbps per pin and improves energy efficiency by over 20% through optimized power design.
Notably, SK Hynix has implemented its proprietary 'Advanced MR-MUF' process, enhancing structural stability. The 12-layer design provides a high capacity of 48GB while reducing thermal resistance by approximately 17% compared to the previous generation. This advancement allows for more effective heat management in AI computing environments.
SK Hynix emphasized, "We are closely collaborating with our key clients based on our accumulated HBM development capabilities and production know-how. We will ensure timely mass production to proactively deliver the value demanded by the market."
In response, Samsung Electronics is also making significant strides. At the end of May, Samsung became the first in the world to supply 12-layer HBM4E samples to global clients, showcasing its advanced technology. This move follows just three months after the announcement of the world's first mass production shipment of HBM4 products in February.
Samsung's HBM4E combines its validated 10-nanometer 6th-generation (1c) DRAM with a 4-nanometer foundry process, ensuring both productivity and process stability. The low-power design improves energy efficiency by 16% and enhances thermal resistance characteristics by over 14%. The company's 'one-stop turnkey' strategy aims to create strong synergies, positioning it favorably in securing supply chains for major tech firms.
With both companies completing their sample shipments within a month, industry experts assess that a fierce second round of competition for the next-generation AI supply chain has begun. As the bidding war reignites for HBM4E, the company that successfully navigates the stringent validation and final approval processes from clients is likely to gain a competitive edge in the market.
Ahn Gi-hyun, Executive Director of the Korea Semiconductor Industry Association, stated, "Both companies are progressing with the development and validation of next-generation products faster than expected. The timing of passing the final quality tests by global tech clients and the speed of transitioning to mass production will be pivotal in determining the future leadership in the AI memory market."
* This article has been translated by AI.
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