Hanmi Semiconductor announced on June 26 that it has launched the 'FC Bonder 3.5' (Flip Chip Bonder 3.5), a new machine designed for artificial intelligence (AI) system semiconductors, which will be supplied to global foundries and outsourced semiconductor assembly and test (OSAT) companies.
The new product targets the 2.5D packaging process, a core technology for AI semiconductors. It supports large panels and substrates up to 340 mm and utilizes a chip-to-wafer (C2W) bonding method, enhancing productivity and precision compared to competitors.
The 2.5D packaging process has been actively adopted by major global tech companies such as NVIDIA, AMD, Broadcom, Marvell, and Apple in their AI chip production, making it a key technology in the AI semiconductor and high-performance computing (HPC) sectors.
Following the introduction of the 'FC Bonder 75' last year, Hanmi Semiconductor is expanding its lineup of AI packaging equipment with this new product.
By the end of this year, the company plans to establish a local subsidiary, Hanmi USA, to accelerate customer acquisition among global tech giants and foundries, focusing on TC bonders for high-bandwidth memory (HBM) and system semiconductor equipment.
Hanmi Semiconductor stated, "We aim to broaden our customer base by supplying not only TC bonders for HBM but also system semiconductor equipment to foundries and OSAT companies in the U.S. market, where major global tech firms are concentrated."
* This article has been translated by AI.
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