According to the Economic Daily News in Taiwan, TSMC and Winbond are partnering in the area of wafer-on-wafer (WoW) three-dimensional stacking technology.
Winbond will supply memory wafers, including DRAM, while TSMC will combine these with logic semiconductor wafers to create stacked structures for AI semiconductors.
WoW is an advanced packaging technology that stacks semiconductor wafers vertically before they are cut into chips. This method creates fine copper connections between the wafers, reducing data transfer distances and enhancing bandwidth and power efficiency. It is considered a solution to mitigate data transfer delays in AI servers and high-performance computing (HPC) applications.
Previously, TSMC primarily relied on global giants such as Samsung Electronics, SK Hynix, and Micron for the memory wafers needed for WoW. However, as demand for AI semiconductors has surged, TSMC is looking to diversify its supply sources by adding a Taiwanese partner to enhance procurement stability.
Winbond specializes in specialty DRAM and NOR Flash, rather than general-purpose DRAM. Its capabilities in 12-inch wafer production, specialized processing experience, and quality control are cited as reasons for this collaboration.
This partnership is seen as TSMC's effort to maintain relationships with global memory companies while enhancing the stability of the AI semiconductor ecosystem. If WoW moves into full-scale production, Winbond could also secure growth opportunities by supplying memory for AI semiconductors.
Winbond has stated that it does not comment on individual customers or business matters. TSMC's official stance has yet to be confirmed.
* This article has been translated by AI.
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