Hanmi Semiconductor is expanding its lineup of packaging equipment for artificial intelligence (AI) system semiconductors. The company is leveraging its expertise gained from its TC Bonder for high-bandwidth memory (HBM) to accelerate its entry into the AI semiconductor equipment market.
On June 30, Hanmi Semiconductor announced the launch of its new 2.5D TC Bonder 40, designed to support AI semiconductor packaging, and plans to supply it to global foundries and outsourced semiconductor assembly and test (OSAT) companies.
Following the introduction of the FC Bonder 75 last year and the FC Bonder 3.5 on June 26, the addition of the 2.5D TC Bonder 40 further strengthens Hanmi's product offerings in the 2.5D packaging equipment for AI system semiconductors.
2.5D packaging is considered a critical process in the AI semiconductor and high-performance computing (HPC) sectors. Major global tech companies such as NVIDIA, AMD, Broadcom, Marvell, and Apple are increasingly utilizing it for their AI chip production, driving demand. Key technologies include TSMC's CoWoS and Intel's EMIB.
The 2.5D TC Bonder 40 is specialized for the 'chip-on-wafer' process of CoWoS. It can handle die sizes ranging from 3x3mm to 40x40mm, making it suitable for high-precision bonding required in AI semiconductor packaging.
Industry experts note that as the competition for AI chip performance shifts from fine processes to advanced packaging capabilities that integrate multiple chips into a single package, the demand for bonding equipment is rapidly increasing.
The new equipment features 'auto conversion' technology that allows for continuous operation with various chip types and a 'reel feeder loading' process that enhances equipment efficiency. An optional 'fluxless bonding' function is also available to reduce defects and improve quality reliability.
The market outlook is promising. According to Yole Group, the advanced packaging market, including 2.5D and 3D technologies, is projected to grow from $46 billion in 2024 to $79.4 billion by 2030, with an average annual growth rate of 9.5%.
Hanmi Semiconductor is also planning to establish a local subsidiary, Hanmi USA, by the end of this year. This initiative aims to expand customer engagement in the U.S. market, which is home to many AI tech giants, foundries, OSAT, and memory companies, and to build partnerships from the chip planning stage.
A Hanmi Semiconductor representative stated, "Building on our technology that secured the global number one position in the HBM TC Bonder market, we aim to expand our influence in the 2.5D packaging market for system semiconductors. We will achieve continuous revenue growth by developing a diverse semiconductor equipment portfolio."
* This article has been translated by AI.
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