President Lee Jae-myung visited an exhibition showcasing SK Group's AI semiconductor technology on June 30, where he received briefings on advanced technologies including server DRAM, high-bandwidth memory (HBM), and storage for AI data centers.
Before attending the 'Southwest Region Advanced Industry Development Vision National Report Meeting' at the Gwangju Kim Dae-jung Convention Center, President Lee toured the SK Group exhibition with Kwak No-jeong, CEO of SK Hynix, as confirmed by Deputy Spokesperson Ahn Gyu-ryeong in a written briefing.
The exhibition featured key AI semiconductor technologies, including server DRAM, HBM, and storage solutions for AI data centers, which are essential infrastructure for the AI era.
During his visit to the server DRAM display, President Lee showed interest by asking about its applications and pricing.
He then examined the next-generation HBM4E wafers, internal structure models, and GPU models equipped with HBM, listening to explanations about the development process and technological advancements of HBM.
While viewing the AI data center storage exhibit, President Lee inquired about the importance of cooling, asking about liquid cooling technology and the cooling methods for servers and semiconductors within data centers.
In response, CEO Kwak provided insights into the current development status and future directions of liquid cooling technology aimed at effectively managing heat generation.
Before attending the 'Southwest Region Advanced Industry Development Vision National Report Meeting' at the Gwangju Kim Dae-jung Convention Center, President Lee toured the SK Group exhibition with Kwak No-jeong, CEO of SK Hynix, as confirmed by Deputy Spokesperson Ahn Gyu-ryeong in a written briefing.
The exhibition featured key AI semiconductor technologies, including server DRAM, HBM, and storage solutions for AI data centers, which are essential infrastructure for the AI era.
During his visit to the server DRAM display, President Lee showed interest by asking about its applications and pricing.
He then examined the next-generation HBM4E wafers, internal structure models, and GPU models equipped with HBM, listening to explanations about the development process and technological advancements of HBM.
While viewing the AI data center storage exhibit, President Lee inquired about the importance of cooling, asking about liquid cooling technology and the cooling methods for servers and semiconductors within data centers.
In response, CEO Kwak provided insights into the current development status and future directions of liquid cooling technology aimed at effectively managing heat generation.
* This article has been translated by AI.
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