Samsung Electronics unveiled its strategies for collaboration in the artificial intelligence (AI) semiconductor ecosystem and next-generation foundry technologies.
On July 1, Samsung hosted the 'SAFE™ Forum 2026' at its Seocho office in Seoul, introducing innovations in ultra-fine semiconductor processes and design strategies. The event, themed 'Connecting Semiconductor Innovation in the AI Era,' attracted over 400 attendees from client and partner companies.
In May, the company held a global edition of the annual 'SAFE Forum 2026' in California for its international clients.
Shin Jong-shin, head of Samsung's Foundry Business Division Design Platform Development, delivered a keynote address emphasizing the need to strengthen collaboration with global high-performance computing (HPC) clients and domestic system semiconductor firms. He stated, "We will expand our role beyond foundry production to become a platform for the domestic system semiconductor industry."
At the event, 21 partner companies showcased various solutions in areas such as EDA, IP, DSP, VDP, and MDI.
Notable examples of AI semiconductor development were shared by key partners. Park Sung-hyun, CEO of Rebellion, presented the development of the 'Rebel100' neural processing unit (NPU), based on Samsung's 4-nanometer process and advanced packaging, and hinted at future collaborations for building sovereign AI.
Jin Marie Brunet, Senior Vice President of Siemens EDA, highlighted the support for yield, design verification, reliability, and packaging, stating that they would assist in implementing AI and HPC semiconductors through Samsung's advanced processes.
Samsung also outlined its AI-customized process roadmap. The company plans to support clients' next-generation product development by maximizing chip performance through design technology optimization (DTCO) strategies, high-performance SRAM technology, and next-generation 2-nanometer process technology, focusing on power, performance, and area (PPA) competitiveness.
Additionally, Samsung aims to enhance collaboration with the government and industry to foster a domestic system semiconductor ecosystem. The company is participating in the Manufacturing AI Transformation (M.AX) alliance, promoted by the Ministry of Trade, Industry and Energy, to develop low-power, high-performance on-device AI semiconductors for automotive, home appliances, robotics, and defense applications.
Samsung plans to activate semiconductor R&D through its Multi Project Wafer (MPW) program, which supports prototype production, and the K-Chips initiative, focusing on training specialized personnel.
* This article has been translated by AI.
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