Samsung Electro-Mechanics announced on July 3 that it plans to invest approximately 15 trillion won in its Busan facility from this year until 2040. The investment will focus on AI server package substrates and multilayer ceramic capacitors (MLCCs).
This investment aims to meet the growing demand for high-performance components driven by the expansion of AI data centers. AI servers require reliable processing of high-performance semiconductors and large amounts of power, increasing the importance of package substrates and high-reliability MLCCs.
Samsung Electro-Mechanics intends to develop its Busan facility into a core base for high-performance package substrates and high-value-added MLCC motherlines. The company also plans to concentrate key research and development functions in Busan to enhance its competitiveness in AI components.
Through this investment, Samsung Electro-Mechanics aims to transition its existing component business into a high-value advanced parts sector centered around AI. Both package substrates and MLCCs are identified as high-growth areas aligned with the demand for AI servers, data centers, and high-performance computing.
The investment plan was unveiled during the 'Gyeongnam Advanced Industry Development Vision National Report Meeting' held on the same day.
However, Samsung Electro-Mechanics noted that this plan is based on current market conditions and may be subject to changes in investment scale and schedule depending on future market situations and management environments.
* This article has been translated by AI.
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