LG Electronics has become the first South Korean company to receive NVIDIA's quality certification for its liquid cooling solutions, accelerating its strategy in the global artificial intelligence (AI) data center market. The company announced on July 27 that it has received final quality certification for its 600-kilowatt (kW) cooling distribution unit (CDU), a key component in controlling the heat generated by high-performance graphics processing units (GPUs). This recognition is expected to boost LG's prospects for securing large-scale projects with major global tech firms.
With this certification, LG plans to begin supplying its self-developed liquid cooling solutions to global AI data center clients, aiming to secure a leading position in the market.
The CDU is essential for circulating coolant within servers and recovering heat in liquid cooling systems. As the performance of high-bandwidth memory (HBM) and GPUs in AI data centers increases, so does the power density and heat output per server rack. Traditional air cooling methods are becoming less effective, highlighting the importance of directly absorbing heat from semiconductor chips using liquid.
LG's CDU employs a direct-to-chip (DTC) method, circulating coolant through cold plates attached to GPUs and central processing units (CPUs). This system operates alongside air cooling to enhance cooling efficiency.
Notably, it achieves temperature control precision of ±0.25 degrees Celsius, improving thermal stability for high-heat GPUs. It supports virtual sensors and leak detection features and integrates with data center management systems. Tests have demonstrated that cooling operations can continue without interruption even when switching to backup devices in the event of a pump or CDU group failure.
This certification signifies LG's entry into the core supply chain for global AI data centers. Clients adopting NVIDIA server racks can choose LG's CDU without lengthy technology validation, potentially shortening project timelines.
LG plans to pursue NVIDIA certification for its entire lineup of large-capacity CDUs, starting with the 600 kW model and expanding to 1 MW, 2.5 MW, and 4 MW units. As power consumption and heat generation from AI servers increase, the demand for megawatt-level liquid cooling systems is expected to grow, prompting LG to position itself as a market leader.
According to LG, the global AI data center market is projected to grow by approximately 26% annually, reaching about $133.5 billion (approximately 185 trillion won) by 2034. Leveraging its experience supplying cooling solutions to North American hyperscalers and the Sinar Mas data center in Indonesia, LG aims to expand its global business.
The company also plans to broaden its product portfolio to encompass all aspects of data center thermal management. This includes a total solution system called 'chip to chiller,' which provides everything from chillers that produce cold water to CDUs that distribute coolant and cold plates that directly absorb heat from semiconductor chips.
LG is utilizing its magnetic bearing compressor technology in the chiller sector while also working on in-house production of key components like inverters for CDUs. In the future, it plans to supply CDUs and apply them in AI data center design, construction, and operation projects with LG CNS, as well as in modular AI data center initiatives.
Lee Jae-sung, head of LG Electronics' ES Business Division, stated, "With the explosive growth of the AI data center market, the importance of reliable liquid cooling solutions is increasing. We will leverage our cooling technology and integrated infrastructure capabilities to lead the global market as a total solution provider for AI data centers."
With this certification, LG plans to begin supplying its self-developed liquid cooling solutions to global AI data center clients, aiming to secure a leading position in the market.
The CDU is essential for circulating coolant within servers and recovering heat in liquid cooling systems. As the performance of high-bandwidth memory (HBM) and GPUs in AI data centers increases, so does the power density and heat output per server rack. Traditional air cooling methods are becoming less effective, highlighting the importance of directly absorbing heat from semiconductor chips using liquid.
LG's CDU employs a direct-to-chip (DTC) method, circulating coolant through cold plates attached to GPUs and central processing units (CPUs). This system operates alongside air cooling to enhance cooling efficiency.
Notably, it achieves temperature control precision of ±0.25 degrees Celsius, improving thermal stability for high-heat GPUs. It supports virtual sensors and leak detection features and integrates with data center management systems. Tests have demonstrated that cooling operations can continue without interruption even when switching to backup devices in the event of a pump or CDU group failure.
This certification signifies LG's entry into the core supply chain for global AI data centers. Clients adopting NVIDIA server racks can choose LG's CDU without lengthy technology validation, potentially shortening project timelines.
LG plans to pursue NVIDIA certification for its entire lineup of large-capacity CDUs, starting with the 600 kW model and expanding to 1 MW, 2.5 MW, and 4 MW units. As power consumption and heat generation from AI servers increase, the demand for megawatt-level liquid cooling systems is expected to grow, prompting LG to position itself as a market leader.
According to LG, the global AI data center market is projected to grow by approximately 26% annually, reaching about $133.5 billion (approximately 185 trillion won) by 2034. Leveraging its experience supplying cooling solutions to North American hyperscalers and the Sinar Mas data center in Indonesia, LG aims to expand its global business.
The company also plans to broaden its product portfolio to encompass all aspects of data center thermal management. This includes a total solution system called 'chip to chiller,' which provides everything from chillers that produce cold water to CDUs that distribute coolant and cold plates that directly absorb heat from semiconductor chips.
LG is utilizing its magnetic bearing compressor technology in the chiller sector while also working on in-house production of key components like inverters for CDUs. In the future, it plans to supply CDUs and apply them in AI data center design, construction, and operation projects with LG CNS, as well as in modular AI data center initiatives.
Lee Jae-sung, head of LG Electronics' ES Business Division, stated, "With the explosive growth of the AI data center market, the importance of reliable liquid cooling solutions is increasing. We will leverage our cooling technology and integrated infrastructure capabilities to lead the global market as a total solution provider for AI data centers."
* This article has been translated by AI.
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