SK Hynix Reports Progress in HBM Price Negotiations Amid Rising DRAM Prices

SK Hynix announced during its second-quarter earnings conference call on July 29 that it is currently negotiating supply volumes and prices for high-bandwidth memory (HBM) with major customers for 2027. The company noted that discussions are progressing smoothly, supported by strong customer demand.

However, SK Hynix emphasized that HBM prices are not solely determined by the recent significant increase in general DRAM prices. The company pointed out that HBM involves more wafers, advanced processes, through-silicon vias (TSV), and packaging capacity, requiring substantial resources.

The company explained that it considers various factors, including the supply and demand environment for general DRAM, the resources and opportunity costs involved in HBM production, technical difficulties, and the value the product provides to customers when negotiating prices individually with clients.