MHS Partners with HyperExcel to Implement Liquid Cooling for AI Chips

By SEONGJUN JO Posted : August 3, 2026, 16:52 Updated : August 3, 2026, 16:52

Thermal management specialist MHS is advancing plans to apply liquid cooling technology to HyperExcel's next-generation AI semiconductors. The collaboration, which began with heat sink supply, aims to expand into cooling solutions for high-heat AI semiconductors.


On August 3, MHS announced it is broadening its cooling technology partnership with AI semiconductor fabless company HyperExcel. The two companies are jointly reviewing thermal management technologies from the product development stage based on a memorandum of understanding (MOU) signed last year.


HyperExcel is developing an LPU architecture specialized for large language model inference operations. Its flagship product, Bertha, targets the generative AI inference semiconductor market.


MHS is currently supplying heat sinks for the evaluation board (EVB) used in the development of Bertha. The evaluation board is a device that verifies performance, power efficiency, and operational stability before mass production of semiconductors.


The two companies are also discussing the application of MHS's liquid cooling technology, MACS, to Bertha. MACS utilizes a microchannel cooling method that circulates coolant through fine channels within a thin cooling plate.


As the computational performance and power consumption of AI semiconductors increase, it has become increasingly difficult to manage heat with traditional air cooling alone. Industry experts anticipate that the adoption of liquid cooling will expand to maintain semiconductor performance and reduce cooling power in data centers.


MHS recently completed the development of thermal management components for Mobilint's next-generation NPU accelerator, MLA400, and is now responsible for mass production supply, expanding its collaboration with domestic AI semiconductor companies from the development stage to mass production.


MHS plans to provide thermal analysis, heat dissipation design, and prototype production, followed by manufacturability review and mass production support. The company is expected to gradually expand the application of thermal management technologies, including heat sinks and liquid cooling, in line with Bertha's development schedule.


Lim Jong-soo, CEO of MHS, stated, "We will provide suitable thermal management solutions for HyperExcel from the evaluation board stage to mass production, and we will also expand our collaboration on liquid cooling using MACS to enhance product competitiveness."





* This article has been translated by AI.

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