Hanmi Semiconductor is showcasing advanced packaging equipment for artificial intelligence (AI) system semiconductors and next-generation high bandwidth memory (HBM) at SEMICON Taiwan.
The company announced its participation in the event, taking place in Taipei, Taiwan, on September 2, 2026. Hanmi Semiconductor has been an official sponsor for 12 consecutive years since 2015.
SEMICON Taiwan, organized by the Semiconductor Equipment and Materials International (SEMI), is the largest semiconductor exhibition in Taiwan, featuring over 1,300 companies and more than 100,000 professionals from around the world.
Recently, Hanmi Semiconductor has expanded its business into the 2.5D packaging sector for AI system semiconductors. This technology integrates multiple chips, including graphics processing units (GPUs), central processing units (CPUs), and HBM, onto a silicon interposer. It is a key component in the manufacturing of AI semiconductors by major global companies such as TSMC's CoWoS and Intel's EMIB.
At the local exhibition, Hanmi will present five types of 2.5D packaging equipment. This includes the FC Bonder 3.5, FC Bonder 75, and 2.5D TC Bonder 40 C2S·C2W, along with the upcoming '2.5D TC Bonder 120.' These systems support interposers and substrates up to 350mm x 350mm, catering to various customer needs.
The company will also unveil the 'TC Bonder 4' for HBM4 mass production and the 'Wide TC Bonder,' which is set to launch next year. The Wide TC Bonder is designed to enhance memory capacity and bandwidth in line with the expansion of DRAM die area.
A Hanmi Semiconductor representative emphasized, "Through SEMICON Taiwan, we aim to expand our supply of HBM TC Bonders and advanced packaging equipment for AI system semiconductors, leading the growth of the global AI semiconductor market."
* This article has been translated by AI.
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