Hanwha Semitek is participating in SEMICON Taiwan 2026, one of Asia's largest semiconductor exhibitions, where it is showcasing four advanced packaging equipment models.
The company announced on September 2 that it is exhibiting at the event, which runs from September 2 to 4 at the Taipei Nangang Exhibition Center. SEMICON Taiwan is a leading international exhibition where major semiconductor companies gather to share the latest technological trends. This year, over 1,300 companies from around the world are expected to participate, creating a vibrant platform for business collaboration.
Hanwha Semitek has set up a booth on the fourth floor of Hall 1 (TaiNEX Hall 1) to introduce four key advanced packaging equipment models that respond to the growing demand for high-density and high-performance packaging. The showcased equipment includes: △ 'SFM5 Square' large area FOPLP equipment △ 'SFM5 Expert' 3D TC bonder △ 'SFM5 TnR' 2.5D CoW bonder △ 'SHB2 Nano' hybrid bonder.
At this event, the 'SFM5 Square' large area fan-out panel-level packaging (FOPLP) equipment will be presented to customers for the first time. Unlike traditional packaging methods that use round wafers, FOPLP utilizes a square panel measuring 600×600 mm, reducing wasted corner areas. This design maximizes production efficiency while lowering manufacturing costs. The SFM5 Square is a precision device that accurately places chips on this large panel.
Hanwha Semitek will also introduce its advanced bonding equipment lineup that supports AI semiconductor manufacturing and high-performance chip stacking.
Notably, the next-generation hybrid bonder 'SHB2 Nano,' developed by Hanwha Semitek in February, features direct contact between copper electrodes and insulators, eliminating gaps between chips. This allows for thinner and denser stacking of chips, enabling ultra-fast data transmission and is considered a key piece of equipment for next-generation high-bandwidth memory (HBM) production.
The 'SFM5 Expert' TC bonder and 'SFM5 TnR' CoW bonder for HBM will also be showcased. Hanwha Semitek successfully began mass production of the TC bonder 'SFM5 Expert,' a core piece of equipment for HBM manufacturing, last year, continuing to achieve steady order results.
The 'SFM5 TnR' is a CoW bonder that precisely bonds semiconductors supplied in different forms using a single device. It can simultaneously handle logic semiconductors in wafer form and HBM supplied as individual chips on tape, significantly enhancing productivity without cumbersome intermediate processes.
Hanwha Semitek plans to leverage this exhibition to promote its advanced packaging portfolio and focus on business collaborations with major global semiconductor manufacturers. The company aims to actively enter the next-generation packaging market, including FOPLP.
A Hanwha Semitek official stated, "This SEMICON Taiwan will be an opportunity to establish our equipment competitiveness in the global market, leading the era of AI and high-performance packaging. We will expand cooperation with global semiconductor clients to accelerate our entry into the next-generation packaging market."
Meanwhile, Hanwha Semitek demonstrated its technological competitiveness in the market by unveiling new chip mounter products aimed at the next-generation equipment market at the largest surface mount technology (SMT) exhibition in Korea last April.
* This article has been translated by AI.
Copyright ⓒ Aju Press All rights reserved.