As demand for artificial intelligence (AI) semiconductors surges, major global semiconductor companies, including Samsung Electronics and Taiwan's TSMC, are rapidly adopting advanced equipment from Dutch semiconductor manufacturer ASML. The 'High Numerical Aperture (High NA) Extreme Ultraviolet (EUV)' technology, capable of drawing finer circuits than before, is emerging as a key component in next-generation semiconductor production.
According to Bloomberg on September 8, Samsung and TSMC plan to begin mass production with ASML's High NA EUV equipment in 2028 and 2030, respectively.
The High NA EUV equipment is considered essential for cutting-edge semiconductor manufacturing. By increasing the numerical aperture (NA) of light, it can gather light from a wider angle, allowing for the implementation of finer circuit patterns on wafers. This technology reduces the number of exposures required for certain processes, enhancing semiconductor miniaturization and production efficiency. The cost of each unit is estimated at around $400 million.
With Intel already utilizing this equipment, major semiconductor firms worldwide are beginning to leverage next-generation EUV technology.
Additionally, Samsung, TSMC, Intel, and ASML are collaborating to develop technology that expands the size of photomasks used in semiconductor manufacturing from the current 6 inches to 12 inches.
Photomasks are design plates used to repeatedly imprint circuit patterns onto semiconductor wafers. The semiconductor industry has relied on 6-inch photomasks for decades, but as circuits become increasingly intricate and the demand for large, complex chips like AI semiconductors grows, the limitations of the existing photomask size have become more pronounced.
According to ASML, applying the new technology could increase the production throughput of High NA EUV equipment by up to 40% while simplifying the design process. Marco Peters, ASML's Chief Technology Officer, stated, "The advancement of High NA EUV technology is crucial for the mass production of semiconductors, and customers are recognizing the advantages of High NA EUV equipment over existing technologies."
Transitioning to 12-inch photomasks has been technically complex and costly, making it difficult to pursue until now. However, as demand for AI semiconductors rapidly increases, ASML's key clients, including Samsung, TSMC, and Intel, are pooling resources to develop 12-inch photomask technology to enhance productivity and reduce costs.
Notably, TSMC has been cautious about adopting High NA EUV equipment due to cost-to-productivity concerns, but the surge in AI semiconductor demand has prompted a more aggressive pursuit of next-generation production technologies. TSMC plans to introduce High NA EUV equipment using existing 6-inch photomasks starting in 2030, followed by a phased implementation of 12-inch photomask technology.
TSMC CEO Wei Zhejia remarked, "We have collaborated to solve technical issues in the semiconductor industry, and it is crucial to overcome these challenges before they lead to cost problems."
Bloomberg noted that TSMC's adoption of High NA EUV equipment, which accounts for about 16% of ASML's total revenue, is significant for ASML.
ASML is the only company in the world capable of producing EUV lithography equipment, which is essential for manufacturing the world's most advanced AI accelerators and semiconductors. ASML anticipates that demand for High NA EUV equipment will continue to grow as semiconductor process technology advances.
* This article has been translated by AI.
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