Samsung Electronics has launched an advanced packaging research center in Yokohama, aiming to enhance its technological competitiveness.
According to reports from Yonhap News and the Nihon Keizai Shimbun (Nikkei), the company held an opening ceremony for the 'Advanced Package Lab' in Yokohama's Minato Mirai area. Samsung plans to invest 40 billion yen (approximately 35 billion won) over the next five years, starting in 2024, to develop advanced packaging technologies.
The company intends to recruit more than 100 research personnel at this facility by next year. Advanced packaging refers to post-processing technologies that integrate semiconductors, such as artificial intelligence (AI) accelerators and high-bandwidth memory (HBM).
Samsung aims to establish the Advanced Package Lab as a global research and development hub for next-generation packaging technologies, while also strengthening collaborations with local materials, parts, and equipment companies and research facilities.
Yokohama is considered advantageous for semiconductor technology development and talent acquisition due to its proximity to the University of Tokyo, Yokohama National University, and leading semiconductor materials and equipment companies like Resonaq and Disco.
The opening ceremony was attended by about 100 people, including Jeon Young-hyun, Vice Chairman of Samsung Electronics' Device Solutions Division, as well as representatives from the Japanese government, local authorities, and partner companies.
Industry experts expect that the establishment of the research center will enhance technological competitiveness by combining Japan's strong materials and components ecosystem with Samsung's semiconductor design and manufacturing capabilities.
According to reports from Yonhap News and the Nihon Keizai Shimbun (Nikkei), the company held an opening ceremony for the 'Advanced Package Lab' in Yokohama's Minato Mirai area. Samsung plans to invest 40 billion yen (approximately 35 billion won) over the next five years, starting in 2024, to develop advanced packaging technologies.
The company intends to recruit more than 100 research personnel at this facility by next year. Advanced packaging refers to post-processing technologies that integrate semiconductors, such as artificial intelligence (AI) accelerators and high-bandwidth memory (HBM).
Samsung aims to establish the Advanced Package Lab as a global research and development hub for next-generation packaging technologies, while also strengthening collaborations with local materials, parts, and equipment companies and research facilities.
Yokohama is considered advantageous for semiconductor technology development and talent acquisition due to its proximity to the University of Tokyo, Yokohama National University, and leading semiconductor materials and equipment companies like Resonaq and Disco.
The opening ceremony was attended by about 100 people, including Jeon Young-hyun, Vice Chairman of Samsung Electronics' Device Solutions Division, as well as representatives from the Japanese government, local authorities, and partner companies.
Industry experts expect that the establishment of the research center will enhance technological competitiveness by combining Japan's strong materials and components ecosystem with Samsung's semiconductor design and manufacturing capabilities.
* This article has been translated by AI.
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