Hanmi Semiconductor is participating in the 2026 SEMICON West, held on October 13 at the Moscone Center in San Francisco, to strengthen its network with global clients through advanced packaging equipment for artificial intelligence (AI) semiconductors.
The company is showcasing its core equipment, the 'TC Bonder 4' for sixth-generation high-bandwidth memory (HBM4), along with the next-generation 'Wide TC Bonder' set to launch next year. The Wide TC Bonder is designed to accommodate high-performance stacking and bonding processes with larger die sizes.
Hanmi is also presenting the 'Micro So&Vision Placement (MSVP)' system, which handles the entire process from cutting to cleaning, drying, inspection, sorting, and loading of semiconductor packages. This equipment is applicable across various processes, including DRAM, NAND flash, HBM, system semiconductors, PCBs, and glass substrates.
Additionally, the company is unveiling a significant lineup of equipment for AI system semiconductor 2.5D packaging. This includes three types of 2.5D TC Bonders and two types of FC Bonders, totaling five pieces of equipment that respond to advanced packaging technologies like TSMC's CoWoS and Intel's EMIB. Hanmi aims to expand its supply to global foundries and outsourced semiconductor assembly and test (OSAT) companies.
A Hanmi Semiconductor representative stated, "We are expanding our supply into the AI system semiconductor 2.5D packaging market and will strengthen collaboration with clients in the U.S. market, where demand for AI semiconductors and manufacturing investments are accelerating."
* This article has been translated by AI.
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