LG Innotek announced that its revenue for the third quarter of this year reached 6.3671 trillion won, an 18.6% increase compared to the same period last year, while its operating profit fell 53.4% to 94.8 billion won.
All business segments reported revenue growth compared to the previous year, marking the first time the company surpassed 6 trillion won in quarterly revenue.
A company representative stated, "The increase in supply of mobile camera modules began as mass production for new models started, and steady demand for high-value semiconductor substrates contributed to revenue growth." They added, "However, the sharp drop in the won-dollar exchange rate between the timing of material purchases and product shipments led to a decrease in operating profit compared to last year."
The optical solutions segment recorded revenue of 5.4041 trillion won, up 20.6% from the previous year. The expansion of supply for high-value camera modules for mobile devices coincided with increased shipments of vehicle cameras to North American customers, contributing to revenue growth.
The package solutions segment achieved revenue of 481.8 billion won, a 10.1% increase year-on-year. Strong demand for semiconductor substrates such as RF-SiP and FC-CSP continued, and revenue also grew due to expanded supply of FC-BGA products for global PC CPU customers.
The mobility solutions segment reported revenue of 481.1 billion won, up 6.8% from the previous year. Sales of key products such as vehicle communication modules and lighting grew, and new business areas like vehicle AP modules and digital keys also showed promising results.
LG Innotek is accelerating the enhancement of its business portfolio focused on high-profit, high-value products while driving initiatives in physical AI sectors such as autonomous driving and robotics to prepare for sustainable growth.
The company aims to strengthen profitability through enhanced competitiveness in its core businesses. The package solutions segment plans to focus on high-value semiconductor substrates like FC-BGA, actively responding to surging market demand by expanding production facilities and considering additional investments both domestically and internationally.
The flagship product, FC-BGA, is set to enter mass production for PC CPUs and gradually expand into high-end markets for AI accelerators and servers by 2028. With differentiated technologies like Cu-Post, RF-SiP aims to solidify its position as a global leader, while FC-CSP is expanding its application areas from mobile APs to memory.
The optical solutions segment plans to enhance productivity through process automation and intelligence based on AX, maximizing cost competitiveness through in-house production of key components and dual sourcing of global production sites.
The mobility solutions segment will focus on strengthening the competitiveness of high-value products such as vehicle communication and lighting, optimizing global production operations, and expanding new businesses like vehicle AP modules and digital keys.
* This article has been translated by AI.
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