Hanmi Semiconductor announced that Executive Kim Byeong-seok received the Silver Tower Industrial Medal for his contributions to achieving the number one position in the global high-bandwidth memory (HBM) TC bonder market and advancing the semiconductor industry supply chain.
The award ceremony, which included the Silver Tower Industrial Medal, took place on October 28 during the opening ceremony of the 2026 Materials, Parts, and Equipment Technology Exhibition at KINTEX in Goyang, Gyeonggi Province.
Hanmi Semiconductor holds the top position in the global market for HBM TC bonders. Executive Kim Byeong-seok was recognized for his role in developing high-precision and high-efficiency TC bonder technology, which contributed to the company's leading market share. His efforts have notably strengthened the competitiveness of the domestic materials, parts, and equipment industry and advanced the industrial supply chain.
Kim Byeong-seok joined Hanmi Semiconductor in 1991 and has worked for 35 years, overseeing TC bonder research and development as the head of the hardware division. He has developed key technologies necessary for HBM high-density stacking and precision bonding, enhancing the competitiveness of Hanmi Semiconductor's equipment.
Kim stated, "This award was made possible by the passion and dedication of my colleagues who have worked together on TC bonder technology development. I will continue to focus on developing high-precision and high-efficiency equipment technology to enhance Hanmi Semiconductor's global competitiveness."
* This article has been translated by AI.
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