Samsung Electronics is partnering with AMD to upgrade the manufacturing and quality testing infrastructure for next-generation memory and storage products. As memory speeds and input/output (I/O) standards rapidly increase, there is a need to enhance the computational performance and bandwidth of testing equipment to validate these advancements.
On November 10, AMD officially unveiled its sixth-generation EPYC Embedded 9006 series SP7 processor. Alongside this, Samsung showcased its next-generation memory products, including DDR5 RDIMM and MRDIMM, as well as enterprise SSDs based on PCIe 6.0 (PM1763) and memory expansion modules based on Compute Express Link (CXL) (CMM-D MD310).
The new processor supports up to 256 cores, achieving up to 1.8 times the data throughput and up to 2.7 times the memory bandwidth compared to its predecessor.
Key applications include automated test equipment (ATE) for semiconductors, enterprise storage controllers, and industrial systems requiring high-performance computing.
Through this collaboration, Samsung aims to proactively secure the computational capabilities, memory bandwidth, and high-speed data processing necessary for validating the performance of next-generation memory and I/O devices. With the recent ramp-up in mass production of new standard products like DDR5 high-speed memory, PCIe 6.0 SSDs, and CXL memory, the processing capacity of testing processes has emerged as a critical factor in semiconductor productivity.
Choi Jang-seok, executive director of Samsung Electronics' memory product planning team, stated, "As memory and I/O technologies evolve, the manufacturing testing environment must also advance to meet the increasing performance and bandwidth requirements. We hope to successfully integrate cutting-edge testing capabilities into our manufacturing testing infrastructure through our collaboration with AMD."
* This article has been translated by AI.
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