SEOUL, February 20 (AJP) - High-bandwidth memory (HBM) is poised to capture 30.6 percent of the global DRAM market by 2028, fueled by the rapid expansion of cloud services and growing investments in artificial intelligence data centers, according to Gaurav Gupta, an analyst at Gartner.
Speaking at SEMICON Korea 2025, Gupta emphasized the increasing role of HBM in the evolving semiconductor landscape.
"As major suppliers refine their technology, the focus will shift toward improving yields," Gupta said. He added that HBM stacking, currently at eight layers, is expected to rise to 16 layers and, eventually, 20 layers.
The broader semiconductor industry is projected to reach $705 billion in revenue in 2025, marking a 12.7 percent increase from $626 billion in 2024.
Analysts forecast a compound annual growth rate of 9.4 percent through 2028, with the market potentially surpassing $1 trillion in revenue by the turn of the next decade, driven largely by demand for GPUs and AI processors.
Clark Tseng, a senior director at SEMI, projected that servers and data centers would account for 34 percent of the total semiconductor market by 2030, underscoring the sector's increasing reliance on high-performance computing.
He also anticipated a rebound in memory prices in the latter half of 2025, following a period of weakness in the first quarter.
In the foundry sector, Tseng noted that growth is expected to continue through 2026, bolstered by advancements in advanced packaging technologies.
However, he cautioned that while TSMC is set to maintain its leadership, competitors such as Samsung Electronics may continue to face significant challenges in the years ahead.
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