SEOUL, November 20 (AJP) - SK Hynix Executive Vice President Choi Woo-jin, head of the company’s Package & Test (P&T) division, emphasized the importance of technological preparedness and adaptability to market shifts.
“Understanding market conditions and customer needs quickly is fundamental, and it’s important to consistently prepare technology that can support this,” Choi said in an interview published on the company’s newsroom on Tuesday.
Choi’s leadership has been instrumental in driving SK Hynix’s success in the AI memory market. He successfully increased production without additional investment by adjusting manufacturing processes when AI memory demand surged last year.
His team pioneered the MR-MUF (Mass Reflow-Molded Under Fill) technology for HBM2E packages in 2019, addressing quality issues related to heat and pressure. They later developed Advanced MR-MUF technology, enabling the successful development and mass production of 12-layer HBM3 and HBM3E.
For his significant contributions to enhancing HBM competitiveness through semiconductor packaging innovation, Choi received the Bronze Tower Order of Industrial Service Merit at the 48th National Productivity Awards on Nov. 7.
“If we don’t forget the basics of technology and quality, and demonstrate a spirit of challenge, we can turn future crises into opportunities,” Choi said.
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