SEOUL, January 06 (AJP) - SK hynix will showcase its next generation artificial-intelligence memory solutions at CES 2026 in Las Vegas, highlighting new high-bandwidth memory and low-power products as demand for AI infrastructure accelerates.
The chipmaker will operate a customer-focused exhibition booth at the Venetian Expo from Jan. 6 to 9, shifting its emphasis from large-scale brand promotion to direct engagement with key clients, the company said.
At the center of the display will be a 16-layer HBM4 product with 48 gigabytes of capacity, which SK hynix plans to unveil publicly for the first time. The company will also present its 12-layer HBM3E with 36GB, a product positioned to support near-term growth in AI servers.
Beyond high-bandwidth memory, SK hynix will introduce SOCAMM2, a low-power memory module designed for AI servers, along with LPDDR6 for on-device AI applications. In NAND flash, the company plans to showcase a 321-layer 2-terabit QLC product aimed at high-capacity enterprise solid-state drives for data centers.
The company will also operate an “AI System Demo Zone,” where it will demonstrate how future memory technologies — including customized HBM, processing-in-memory solutions and CXL-based memory modules — could integrate into next-generation AI systems.
SK hynix said the exhibition reflects its strategy to deepen its role in AI infrastructure by expanding its portfolio of specialized memory products and strengthening collaboration with customers.
“As innovation triggered by AI accelerates further, customers’ technical requirements are evolving rapidly,” said Justin Kim, president and head of AI Infrastructure at SK hynix. “We will meet those needs with differentiated memory solutions, and through close cooperation with customers, create new value that contributes to the advancement of the AI ecosystem.”
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