Hanmi Semiconductor said in a regulatory filing on the 27th that Chairman Kwak Dong-shin bought 3 billion won ($2.2 million) worth of the company’s shares with his personal funds, carrying out a share-purchase plan disclosed March 30.
The purchase price was 315,407 won per share, for a total of 3 billion won. Since 2023, Kwak has bought a combined 56.5 billion won worth of Hanmi Semiconductor shares, raising his stake to 33.57%.
The company said Kwak’s continued purchases reflect his confidence in the technology and growth prospects of its TC (thermocompression) bonders in the global market for high-bandwidth memory, or HBM, equipment.
Hanmi Semiconductor said it is maintaining its lead in the global market for TC bonders used in HBM production, and is taking the lead in supplying its “TC Bonder 4” to global manufacturers this year as mass production of HBM4 ramps up.
By the end of this year, the company plans to launch a “wide TC bonder” to support next-generation HBM production. It said the equipment is designed for next-generation HBM with a significantly expanded die area compared with existing HBM, aimed at meeting rising memory capacity and bandwidth needs tied to next-generation artificial intelligence infrastructure demand.
The company also said it plans to release a prototype of a “second-generation hybrid bonder” within this year, targeting the hybrid bonding market expected to see full-scale mass-production adoption in 2029. It said it will begin full operation of a “hybrid bonder factory” in the first half of next year as part of a strategy to secure an early lead in next-generation semiconductor packaging.
“This share purchase is a strong expression of Chairman Kwak’s commitment to responsible management,” a Hanmi Semiconductor official said. “As a first mover in the global semiconductor equipment industry, we will achieve sustainable growth.”
* This article has been translated by AI.
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