Samsung Electro-Mechanics and LG Innotek showcased their competing 'AI PCB strategies' at the KPCA Show 2026, held from September 9 to 11 at Songdo Convensia in Incheon. Samsung Electro-Mechanics, already supplying AI accelerator and server PCBs, is advancing next-generation packaging technology with its 2.5D, 2.1D, and glass PCBs. Meanwhile, LG Innotek introduced its first AI accelerator PCB exceeding 100mm, transitioning its FC-BGA business from a PC focus to high-performance AI applications.
Both companies are exhibiting next-generation semiconductor packaging solutions at the event. The rise of generative AI is leading to an increase in the number of chips and memory in accelerators, resulting in larger PCBs with denser circuits.
Samsung Electro-Mechanics emphasized its 2.5D and 2.1D packaging solutions. The 2.5D PCB incorporates technology to suppress warping and reliably transmit high-speed signals in large, multilayer structures. The 2.1D PCB connects chips without a silicon interposer, targeting high integration and process efficiency for AI semiconductors. The company also unveiled glass PCB technology that utilizes glass as a core material to reduce warping and signal loss.
In contrast, LG Innotek's highlight is the debut of its FC-BGA for AI accelerators. The new product features a large PCB exceeding 100mm on one side, showcasing samples that increase the area by approximately 40% compared to the existing 85mm x 85mm products. LG Innotek aims to begin mass production of high-value FC-BGA for AI learning and inference applications by 2027.
The current market positions of the two companies differ significantly. Samsung Electro-Mechanics began mass production of server FC-BGA in 2022, supplying products for AI accelerators and server CPUs to major global tech firms. In contrast, LG Innotek is transitioning from a PC chipset-focused FC-BGA to producing AI accelerator products by 2027.
Both companies are also focusing on glass PCB technology for next-generation solutions. Samsung Electro-Mechanics is showcasing a key process that creates fine connection pathways in glass and fills them with metal. LG Innotek aims for mass production of glass PCBs by 2028 and has introduced 'chip embedding' technology, which reduces connection distances by embedding chips within the PCB. While both companies target the AI market, Samsung Electro-Mechanics emphasizes advanced packaging structures, whereas LG Innotek is rapidly expanding its business scale through larger formats and new production methods.
The significance of AI PCBs is reflected in their financial performance. Samsung Electro-Mechanics' package solution division reported second-quarter sales of 771.6 billion won, a 37% increase from the previous year. LG Innotek's package solution business recorded sales of 935.6 billion won and an operating profit of 99.6 billion won in the first half of the year, with a goal to grow this division's operating profit to 1 trillion won by 2031.
Joo Hyuk, Vice President of Samsung Electro-Mechanics' Package Solution Division, stated, "We will enhance our large-area, high-layer, and ultra-fine circuit technologies to respond to the high-end semiconductor packaging market." Cho Ji-tae, Executive Director of LG Innotek's Package Solution Division, remarked, "We will lead a paradigm shift in the PCB market with innovative products."
* This article has been translated by AI.
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