Hanmi Semiconductor has reported an operating profit margin exceeding 50% for the third quarter of this year, driven by demand for high-bandwidth memory (HBM) equipment for artificial intelligence (AI) semiconductors. The company anticipates record annual revenue this year, citing that some equipment sales have been deferred to the fourth quarter.
On October 30, Hanmi Semiconductor announced consolidated revenue of 181 billion won and an operating profit of 90.8 billion won for the third quarter of 2026. Compared to the same period last year, revenue increased by 8.9%, while operating profit rose by 33.9%. The operating profit margin reached 50.2%, up 9.4 percentage points from the previous year.
The growth rate of operating profit outpaced that of revenue, with the share of operating profit in revenue rising from 40.8% to 50.2% over the year. This improvement in profitability is attributed to a product mix focused on AI semiconductor packaging equipment.
Hanmi Semiconductor explained that it continued to achieve revenue growth despite the impact of currency fluctuations and the delayed recognition of some equipment sales to the fourth quarter. The company expects record revenue in the fourth quarter, supported by deferred equipment sales and an expansion of supply to overseas clients. As a result, it anticipates surpassing its previous annual revenue records set in 2024 and 2025.
The core business driving these results is the thermal compression (TC) bonder used in HBM manufacturing. Hanmi Semiconductor expects demand for TC bonders to increase as the number of layers in next-generation HBM rises. The company is also pushing for mass production of new TC bonders and flip-chip (FC) bonders needed for large-area AI semiconductor packaging.
Expansion into overseas markets is also underway. In October, Hanmi Semiconductor established a local subsidiary, Hanmi USA, in San Jose, California. This move aims to strengthen local technical support and customer acquisition amid increasing investments in semiconductor manufacturing facilities and advanced packaging in the United States.
* This article has been translated by AI.
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