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Under the theme “Memory, Powering AI and Tomorrow,” the company is showcasing a suite of cutting-edge memory products designed for artificial intelligence applications across data centers, on-device computing, and the automotive sector.
Among the highlights of SK hynix’s exhibit is its HBM3E 12-layer high-bandwidth memory, a key component in next-generation AI processing. Also on display is the SOCAMM (Small Outline Compression Attached Memory Module), a technology gaining traction as a new memory standard for AI servers.
Senior executives, including Chief Executive Kwak No-jung, AI Infrastructure President and Chief Marketing Officer Kim Joo-sun, and Executive Vice President Lee Sang-rak, are attending the event, seeking to strengthen collaborations with leading players in the AI industry.
SK hynix was the first company to mass-produce fifth-generation high-bandwidth memory (HBM3E) in a 12-layer configuration.
The firm plans to complete preparations for mass production of its next-generation HBM4 12-layer products in the latter half of the year, with commercial availability aligned to customer demand. A prototype of the HBM4 module is also being showcased at the event.
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