[Photo: SK Hynix]
SK Hynix is enhancing its production capacity for the sixth-generation High Bandwidth Memory (HBM), known as HBM4, by acquiring key equipment from Hanmi Semiconductor. This move is seen as a proactive investment to meet the rising demand for NVIDIA's next-generation AI accelerators.
On June 8, Hanmi Semiconductor announced that it has received an order from SK Hynix for the 'TC Bonder 4.5 Griffin' equipment used in HBM4 manufacturing. The contract is valued at 44.2 billion won (approximately $33 million), with the agreement effective from the announcement date until September 2.
Given that the price for each TC Bonder is around 3 billion won, it is estimated that the order will involve approximately 15 units. This equipment is crucial for the HBM stacking process and will directly impact the increase in HBM production capacity.
The 'TC Bonder 4.5 Griffin' being supplied is an upgraded version optimized for SK Hynix's production lines. It is expected to be deployed at the new production facility M15X, currently under construction in Cheongju, North Chungcheong Province.
To secure production capacity for HBM and next-generation DRAM, SK Hynix is investing a total of 20 trillion won in the M15X facility. Following the early operation of the first cleanroom in October last year, the company opened a second cleanroom in February this year, accelerating its mass production setup.
The significant influx of TC Bonders essential for HBM4 production is expected to further boost SK Hynix's strategy for expanding HBM4 mass production. HBM4 is a key memory product that will be integrated into NVIDIA's next-generation AI platform, Vera Rubin.
This equipment order is seen as a signal for the expansion of HBM4 supply to NVIDIA. Indeed, Jensen Huang, CEO of NVIDIA, stated on June 5 at Gimpo Airport that "certifications for HBM4 from Samsung Electronics, SK Hynix, and Micron have been completed, and mass production is currently underway."
On June 8, Hanmi Semiconductor announced that it has received an order from SK Hynix for the 'TC Bonder 4.5 Griffin' equipment used in HBM4 manufacturing. The contract is valued at 44.2 billion won (approximately $33 million), with the agreement effective from the announcement date until September 2.
Given that the price for each TC Bonder is around 3 billion won, it is estimated that the order will involve approximately 15 units. This equipment is crucial for the HBM stacking process and will directly impact the increase in HBM production capacity.
The 'TC Bonder 4.5 Griffin' being supplied is an upgraded version optimized for SK Hynix's production lines. It is expected to be deployed at the new production facility M15X, currently under construction in Cheongju, North Chungcheong Province.
To secure production capacity for HBM and next-generation DRAM, SK Hynix is investing a total of 20 trillion won in the M15X facility. Following the early operation of the first cleanroom in October last year, the company opened a second cleanroom in February this year, accelerating its mass production setup.
The significant influx of TC Bonders essential for HBM4 production is expected to further boost SK Hynix's strategy for expanding HBM4 mass production. HBM4 is a key memory product that will be integrated into NVIDIA's next-generation AI platform, Vera Rubin.
This equipment order is seen as a signal for the expansion of HBM4 supply to NVIDIA. Indeed, Jensen Huang, CEO of NVIDIA, stated on June 5 at Gimpo Airport that "certifications for HBM4 from Samsung Electronics, SK Hynix, and Micron have been completed, and mass production is currently underway."
* This article has been translated by AI.
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