SK Hynix announced during its second-quarter earnings conference call on July 29 that it is currently negotiating supply volumes and prices for high-bandwidth memory (HBM) with major customers for 2027. The company stated that discussions are progressing smoothly, supported by strong customer demand.
However, SK Hynix noted that HBM prices are not solely determined by the recent significant increase in general DRAM prices. The company emphasized that HBM involves more wafers, advanced processes, through-silicon vias (TSV), and packaging capacity, requiring substantial resources.
The company explained that it considers not only the supply and demand environment for general DRAM but also the resources and opportunity costs involved in HBM production, the technical difficulties, and the value the product provides to customers when negotiating prices individually with clients.
* This article has been translated by AI.
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