SK hynix is expanding its collaboration with global clients by showcasing a comprehensive range of memory products for artificial intelligence (AI) data centers. The company is highlighting its capabilities in the AI infrastructure market by broadening its portfolio to include high-bandwidth memory (HBM), server DRAM, and enterprise solid-state drives (SSDs).
On August 25, SK hynix participated in the 'Dell Technologies Forum 2026' held at COEX in Gangnam, Seoul, where it unveiled AI memory products, including HBM4 and HBM4E. The event featured physical HBM4 wafers, as well as SOCAMM2 server DRAM and three-dimensional stacked memory modules.
The company also displayed enterprise SSDs, including products that support liquid cooling, high-capacity and low-power options, and its first quad-level cell (QLC) based enterprise SSD. These products are designed to meet the growing demands for computation, data storage, and processing in AI data centers.
Notably, SK hynix delivered a keynote speech at the forum as a representative partner of Dell for the first time. Vice President Joo Young-pyo, in charge of system architecture, discussed the role of memory technology in the AI era and the direction of next-generation technologies.
SK hynix began mass production of HBM4 for major clients in the second quarter of this year and is currently expanding its production capacity. The company has supplied 12-layer product samples of HBM4E to key customers and is preparing for mass production next year.
Industry experts believe that as competition in AI infrastructure expands beyond GPU performance to include overall system optimization involving memory and storage, collaboration between memory manufacturers and server companies will become increasingly important.
A representative from SK hynix stated, "We have solidified our partnership with Dell and showcased our technological capabilities as a full-stack AI memory company. We will expand our strategic partnerships with global tech giants."
* This article has been translated by AI.
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