Samsung Electronics has officially launched pilot production at some lines of its Taylor Fab in Texas, marking a significant step toward establishing a local advanced manufacturing system. The introduction of test wafers for prototype production indicates that the facility is moving closer to full operational capacity.
According to reports from foreign media and industry sources on September 13, Samsung's Taylor Fab began operating its pilot lines this month, initiating comprehensive process optimization and stabilization efforts. Currently, some lines are in pilot operation with test wafers being introduced.
However, the official pilot operation for the entire line has been postponed to later this year, with a target set for the third quarter. This delay is interpreted as a strategy to maximize initial yield through equipment setup and pilot operations before establishing a complete supply chain in time for mass production early next year.
Originally designed as a general-purpose line focused on 4nm technology, the Taylor Fab is now accelerating the integration of 2nm gate-all-around (GAA) and advanced 3D packaging lines due to the rapid growth of the AI semiconductor market. The demand for ultra-fine process technology has increased, making it crucial for Samsung to fine-tune processes to meet the specifications of its big tech clients.
As a result, the key task for the operational pilot lines is to demonstrate actual mass production yields to major clients who have already confirmed their orders and to pass final quality tests. Samsung has secured contracts for next-generation AI chips with Tesla and custom 2nm AI chips based on Arm architecture. The success of the first test chips produced in the Taylor Fab, meeting customer standards for yield, heat generation, and power efficiency, is seen as a pivotal moment for the business's recovery.
Internal process stability indicators are reportedly favorable. Industry sources indicate that Samsung's 4nm yield has stabilized at over 80%. The previously low yield of 2nm GAA, which lingered in the 20% range, has recently improved to over 70%, enhancing competitiveness in advanced processes. The wafer production capacity at the Taylor Fab is approximately 50,000 wafers per month, nearing the scale of Taiwan's TSMC, which produces 80,000 wafers monthly. If the 2nm yield stabilizes, it could lead to rapid improvements in profitability.
Despite securing technological competitiveness, the global foundry market continues to face upward and downward pressures. According to market research firm TrendForce, Samsung's foundry market share was 5.9% in the second quarter, widening the gap with TSMC, which holds 72.5%. Meanwhile, China's SMIC, ranked third, increased its second-quarter revenue by 20% compared to the previous quarter, closing in with a 0.5% point difference.
An industry insider stated, "Achieving an 80% yield for 4nm and improving 2nm GAA yield to the 70% range indicates that the processes have entered a stabilization phase. If we can prove mass production capability by passing quality tests for custom chips for big tech, it will provide substantial momentum for foundry growth."
* This article has been translated by AI.
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