Hanmi Semiconductor Ships First 'FC Bonder 75' for AI Packaging

Hanmi Semiconductor has shipped its AI semiconductor 2.5D packaging equipment, the 'FC Bonder 75', to global customers for the first time. This marks an expansion into the advanced packaging market for system semiconductors, following the TC Bonder for high-bandwidth memory (HBM).

The FC Bonder 75 supports large interposer packaging of 75mm x 75mm, allowing for a larger area than the standard 20mm x 20mm semiconductor packaging. This capability is essential for accommodating the large dies and multi-chip integration required for next-generation AI semiconductors.

As the performance of AI semiconductors increases, the importance of 2.5D packaging technology, which integrates multiple semiconductors such as central processing units (CPUs), graphics processing units (GPUs), and HBM into a single package, has grown. Consequently, the demand for packaging equipment capable of handling larger packages has also risen, driven by the expansion of interposer and substrate sizes.

TSMC's 'CoWoS' is a leading example of 2.5D packaging technology. TSMC plans to advance its packaging technologies from CoWoS to CoPoS and 3D-SoIC in the future. The adoption of TSMC's packaging technology by outsourced semiconductor assembly and test (OSAT) companies is increasing, and Intel's EMIB-T technology is also seeing more applications in custom semiconductors (ASICs) for major U.S. tech firms like Google.

In response to the growing demand for advanced packaging in AI semiconductors, Hanmi Semiconductor is expanding its 2.5D packaging equipment lineup. This year, it has launched the 'FC Bonder 3.5' and '2.5D TC Bonder 40 C2S' and '2.5D TC Bonder 40 C2W', with the '2.5D TC Bonder 120' set to be released soon.

Hanmi Semiconductor is also accelerating its efforts in the U.S. market. The company plans to establish a local subsidiary, 'Hanmi USA', in October. This move is part of a strategy to meet the anticipated demand from AI big tech, foundries, OSAT, and memory companies in the U.S. starting in 2028.

A representative from Hanmi Semiconductor stated, "With the first shipment of the FC Bonder 75, we are supplying not only TC Bonders for HBM but also TC Bonders for AI packaging and various packaging equipment to our customers. We aim to enhance our technological competitiveness in the AI semiconductor market and achieve sustained revenue growth."