SEOUL, September 23 (AJP) - LG Electronics and SK Enmove are expanding their partnership in thermal management technology, jointly developing next-generation refrigerants and immersion cooling solutions for AI data centers and other high-heat applications.
The companies signed a memorandum of understanding Monday to jointly develop refrigerants, refrigeration oils and immersion cooling technologies for home appliances and commercial and industrial systems.
Under the agreement, the companies will develop refrigerants with a global warming potential below 150 and without PFAS, as environmental regulations tighten in Europe and North America. SK Enmove will develop and evaluate refrigerant candidates, while LG will assess their use in HVAC products and systems.
The two companies will also expand their existing work on immersion cooling, which removes heat by directly submerging servers and other equipment in electrically non-conductive cooling fluid. They plan to explore applications beyond AI data centers, including energy storage systems and electric vehicle components.
LG and SK Enmove have previously worked with U.S.-based Green Revolution Cooling on proof-of-concept testing and potential commercialization of immersion cooling systems for AI data centers.
- LG Electronics and SK Enmove will jointly develop next-generation refrigerants, refrigeration oils and immersion cooling technologies.
- The companies are targeting refrigerants with a global warming potential below 150 and no PFAS as environmental rules tighten.
- Their immersion cooling partnership will expand beyond AI data centers to explore ESS and EV component cooling applications.
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