Lee Jae-yong, chairman of Samsung Electronics, and Chey Tae-won, chairman of SK Group, will reunite with Jensen Huang, CEO of NVIDIA, in New York. Their meeting comes shortly after the conclusion of the U.S.-China summit, raising interest in what key collaborative initiatives the leaders in the global AI semiconductor market will unveil.
According to industry sources on the 27th, Lee and Chey will attend the 'Korea Society Annual Gala' in New York on the 28th (local time). Huang is also confirmed to be present as this year's recipient of the Van Fleet Award.
This meeting is particularly noteworthy amid escalating U.S.-China technology competition. After attending the state dinner following the U.S.-China summit, Huang will meet with the heads of major domestic semiconductor companies in succession.
Industry experts predict that the next-generation high-bandwidth memory (HBM) supply chain will be a significant focus of discussion. Samsung Electronics and SK Hynix have established themselves as key partners for NVIDIA in the essential HBM market for AI accelerators.
Samsung is pursuing long-term supply of next-generation HBM4E and HBM5, primarily through its DS division, while SK Hynix is expanding its collaboration, including joint development of next-generation AI memory.
There is also a strong possibility that discussions will extend beyond simple memory supply to encompass the entire AI infrastructure. As NVIDIA accelerates its expansion into data centers and AI factory ecosystems, Samsung and SK Group are vigorously advancing semiconductor-based AI data center infrastructure projects. Notably, SK Group has been seeking comprehensive collaboration with NVIDIA, focusing on AI factory construction and memory supply through SK Telecom and SK Hynix.
An industry insider noted, "Attention is on whether strategic discussions will take place regarding memory supply plans aligned with NVIDIA's next-generation AI semiconductor roadmap and future AI infrastructure development."
* This article has been translated by AI.
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