SK Hynix has once again received official recognition for its exceptional artificial intelligence (AI) memory technology and partnership achievements through TSMC.
On September 23, local time, SK Hynix participated in the TSMC OIP (Open Innovation Platform) Conference held in Santa Clara, California, where it was awarded the 'Partner of the Year' for the second consecutive year, based on its collaboration in HBM (High Bandwidth Memory) utilizing TSMC's advanced packaging process (CoWoS).
The company also unveiled a range of key AI memory products, including the sixth-generation HBM4 and SOCAMM2, as well as its high-performance eSSD lineup and next-generation data center solutions like HBF.
During the technology presentation session, strategies for developing customized HBM to overcome memory bottlenecks in the AI era were discussed, along with synergies with TSMC's foundry processes. The importance of a one-team collaboration system to optimize logic semiconductors and memory from the early design stages was also emphasized.
A representative from SK Hynix stated, "We will further strengthen our collaboration with global key partners like TSMC in line with the growth of the AI semiconductor market and continue to expand our leadership in next-generation AI memory tailored to customer needs."
* This article has been translated by AI.
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