Hanmi Semiconductor Secures 24.48 Billion Won Equipment Order from Samsung Electro-Mechanics

by SEONGJUN JO Posted : October 6, 2026, 08:36Updated : October 6, 2026, 08:36

Hanmi Semiconductor has received an order worth 24.48 billion won for semiconductor backend equipment from Samsung Electro-Mechanics. The company will supply its self-developed Micro Saw & Vision Placement (MSVP) equipment, which combines cutting and inspection capabilities.


On October 6, Hanmi Semiconductor announced the contract for the MSVP supply with Samsung Electro-Mechanics. Kwak Dong-sin, chairman of Hanmi Semiconductor, expressed his welcome to the Samsung Group regarding this order.


The MSVP equipment integrates a 'Micro Saw' for precise cutting of semiconductor packages with a 'Vision Placement' system that performs inspection and sorting after cleaning and drying. According to the company, it is applicable in processes involving DRAM, NAND flash, high-bandwidth memory (HBM), system semiconductors, printed circuit boards (PCBs), and glass substrates. While the TC bonder for HBM stacks chips in multiple layers using heat and pressure, the MSVP handles package cutting and inspection and sorting.


Hanmi Semiconductor plans to adhere to delivery schedules aligned with Samsung Electro-Mechanics' production timeline and will manage installation and initial operation quality. The company also intends to deploy dedicated after-sales service personnel and vehicles to respond to customer needs.


This equipment incorporates cutting technology that Hanmi Semiconductor has localized. Since launching the first generation of Vision Placement in 1998, the company had relied on cutting equipment supplied by Japan's Disco. To reduce import dependency, Hanmi Semiconductor began developing its own technology and introduced the 'Micro Saw' in 2021, internalizing key technologies to supply both cutting and inspection equipment.


In addition to the MSVP, Hanmi Semiconductor also supplies TC bonders for HBM production and 2.5D packaging equipment. Recently, the company has expanded its offerings by launching four types of 2.5D packaging equipment, broadening its client base in semiconductor contract manufacturing and backend processing.


Kwak Dong-sin stated, "Based on the internalization of core process equipment technology and vertical integration manufacturing capabilities, we have consistently supplied high-precision and high-reliability equipment that meets customer demands. We will prioritize customer satisfaction and focus our capabilities on providing the core values that our customers need."





* This article has been translated by AI.