SK Hynix announced during its second-quarter earnings conference call on July 29 that it began mass production of HBM4 for major customers starting in the second quarter. The company stated that the current production yield and quality are nearing the maturity levels of the previous generation HBM3 products. It is also expanding its supply capacity steadily.
The company noted that development is progressing smoothly according to schedule, with plans for the next-generation HBM4E targeting full-scale production in 2027.
Regarding HBM competitiveness, SK Hynix emphasized that the strength of HBM4 lies in its ability to meet customer performance requirements while ensuring stable yields and quality for mass supply. The company has consistently demonstrated this capability, highlighting that its accumulated competitiveness in terms of market launch timing, product performance, production yield, quality, and customer trust is a unique differentiator that cannot be easily replicated in a short period.
The company is also accelerating the development of next-generation HBM technology. It is working on IHBM technology to effectively manage heat issues in next-generation products like HPM5, which is expected to reduce thermal resistance by over 30% through internal cooling solutions. This advancement aims to enhance system stability and operational efficiency in high-performance, high-density AI environments.
Looking ahead, SK Hynix expressed confidence in maintaining its leadership in the HBM market, leveraging its early joint development experiences and long-term partnerships to reliably supply products that meet customer demands while leading the transition to next-generation technologies.
* This article has been translated by AI.
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