Samsung Electronics is participating in SEDEX 2026, held at COEX in Seoul, on October 14, showcasing key semiconductor products and technology solutions for various AI applications.
The company’s semiconductor division is presenting six exhibition zones under the theme of 'Architecting AI Systems,' which include next-generation technology, cloud AI, edge AI, physical AI, semiconductor clusters, and win-win cooperation.
Leveraging its integrated capabilities across memory, logic design, foundry, and advanced packaging, Samsung is introducing a range of AI semiconductor solutions.
In the memory sector, the company is showcasing high-performance 7th generation high bandwidth memory (HBM4E), LPDDR-PIM with built-in processing capabilities, and a 3D memory architecture called 'zHBM' designed to reduce physical distance, along with 'zNAND-O' for edge AI (mockups shown).
In the foundry and system LSI sectors, Samsung is displaying HBM4E base die using a 4-nanometer process and the mobile application processor 'Exynos 2600.'
The newly established 'Semiconductor Cluster Zone' introduces plans for the Yongin National Industrial Complex, where Samsung aims to invest approximately 360 trillion won. Construction is set to begin in 2027, with the first production line expected to be operational by October 2029. About 70 materials, components, equipment, and fabless companies are anticipated to establish an organic semiconductor ecosystem there.
Through the 'Win-Win Cooperation Zone,' Samsung will reveal various support programs for partner companies, including funding, technology, personnel, and training, as well as achievements in mutual growth. Since the founding of the 'Cooperation Association' in 1981, Samsung has continued its efforts for mutual growth, receiving the highest rating for 14 consecutive years in the '2025 Mutual Growth Index Evaluation.'
Additionally, the DS division will deliver 'Win-Win Cafes' coffee trucks to key partner sites over the next two months and will host a 'Movie Day' event in December as part of the 'DS Together' initiative.
* This article has been translated by AI.
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