Hanmi Semiconductor has received an appreciation award from SK Hynix for its contributions to the innovation of high-bandwidth memory (HBM) production technology and stable mass production support. The recognition highlights over a decade of equipment technology collaboration between the two companies during the growth of the HBM market.
Hanmi Semiconductor established its partnership with SK Hynix in 2015 by developing a thermal compression (TC) bonder for HBM production. In 2017, it successfully developed the country's first dual TC bonder, which was recognized for doubling productivity compared to existing equipment. The two companies jointly received the IR52 Chang Yong-sil Award that same year.
Since then, Hanmi Semiconductor has supplied TC bonders necessary for mass production across HBM generations, from HBM2 to HBM3 and HBM3E, supporting SK Hynix's production capacity expansion. These bonders are utilized in SK Hynix's HBM production.
Beyond equipment supply, the two companies have established a field response system. Hanmi Semiconductor operates offices at SK Hynix's Cheongju and Icheon facilities. It also runs a specialized team, 'Silver Phoenix,' to respond to technical requests related to the equipment.
Over the past decade, Hanmi Semiconductor has recorded cumulative sales of approximately 600 billion won from supplying TC bonders and other equipment to SK Hynix.
Hanmi Semiconductor Chairman Kwak Dong-shin stated, "We will continue to enhance our equipment competitiveness in line with the development of next-generation HBM technology and contribute to the success of our customers and the advancement of the global semiconductor industry."
* This article has been translated by AI.
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